Toshiba and Sandisk team up to make ‘3-D’ memory chip of 1TB to replace internal memory for Smartphones

        

         
              Toshiba is teaming up with US chip giant SanDisk to produce a “3D” memory chip with 1TB storage,which they hope will allow users to save up to 50 hours of ultra-high definition video. In a deal worth a reported ¥500 billion (RM15.8 billion) ($4.84 billion), the companies will build a factory to make flash memory consisting of several layers of semiconductors stacked together to give as much as 1TB – or 1,000GB – of storage.

                That is around 16 times bigger than the largest 64GB Toshiba memory currently available in smartphones and tablet devices.Toshiba will demolish its existing plant in Japan to build a new facility that will house production apparatus using technologies from both firms and which the firms hope will start operating in 2016, a statement said.

                 “In about five years (from the planned start of the factory), we would like to produce one-terabyte products,” said a Toshiba spokeswoman.

                   The plan comes at a time of increasing competition among the world’s technology firms to meet demand for ever-higher capacity memory chips for consumers increasingly using mobile devices such as smart phones, tablet computers and wearable gadgets.

                  The spread of high-definition video, with so-called 4K screens at the leading edge, is boosting demand for computing memory to store content.

                    “Small, high-capacity memories can of course be applied to smartphones, but they could also be used for wearable devices,” the Toshiba spokeswoman said.

                        Yasuo Naruke, Toshiba senior vice president, said in a statement: “Our determination to develop advanced technologies underlines our commitment to respond to continued demand (for) flash memory.”

                    Manufacturers have traditionally competed with regular chips by trying to make the physical object smaller.Toshiba, along with major rivals such as Samsung, believe they are reaching the physical limit, and are shifting toward 3D memories, where layering – effectively a third dimension – is used to boost the capacity of objects the same size.

                       SanDisk president and chief executive Sanjay Mehrotra said the plant “will advance our leadership in memory technology into the 3D… era”.

                       With the advent of this 3D memory technology could  see smartphones and wearable devices with internal memory soon in terms TB's soon...

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About arun

Hi ,this is Arun the Founder and Editor in Chief at Techconfigurations.com ,He is basically a tech enthusiast and love to spend time with tech gadgets, he is also interested in product design ,in his free time he loved to travel and watch sci fi and fantacy movies.