Tech world is now celebrating the rumours about the next flagship device from Samsung ,the Galaxy S5 prime also called as Galaxy F(SM-G906).Recently there has been some image leaks of Galaxy F which suggest the device will have metal body with a brushed metal finish on the back .
There is no info on the actual specs of the Galaxy F, but As the rumors have it, this should be an upgraded version of the Galaxy S5 ,could possibly sport a 5.5inch QHD Amoled display with a display resolution of 2560x1440 pixels.Under the hood the device is expected to have Snapdragon 805 chipset coupled with a 3GB of RAM.Some rumours suggest that the processor will be APQ8084 variant of Snapdragon 805,which implies that the device will have 2.7GHz Quad-core Krait 450 CPU and Adreno 420 GPU which will ensure seamless multimedia performance for this device.
Other hardware specs include heat rate sensor and finger print sensor debuted in Galaxy S5,although there is no official confirmation about this, but finger print sensor is clearly visible in the leaked images.
The connectivity option include a Wi-Fi,Bluetooth 4.0,and faster LTE connectivity with a high data transfer rate of 225Mbps. The LTE speed of 225Mbps means the the device is capable of transferring 28.12 MB/s.
Samsung Galaxy F has already got certified in korea and has already imported in india for testing.Despite of the rumours of june release ,we haven't got any solid info about the launch date of the new flagship.
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